Professioneller Hersteller von BGA-Verpackungssubstraten.

Tel:+086 0755 85241496 |

PackageSubstrates-ProfessionalFlip-ChipPackagingSubstrateSupplier

Verpackungs-Substrate

  1. Heim
  2. Produkte
  3. Verpackungs-Substrate
QFN Package

QFN-Paket
QFP Package Substrate

QFP-Gehäuse-Substrat
DIP Package Substrate

DIP-Gehäuse-Substrat
LCC Package Substrate

LCC-Gehäuse-Substrat
Ball Grid Array Package Substrate

Ball Grid Array Package Substrat
2D IC Package Substrate

2D-IC-Gehäuse-Substrat
2.5D IC Package Substrate

2.5D-IC-Gehäuse-Substrat
3D IC Package Substrate

3D-IC-Gehäuse-Substrat
FCBGA package substrate

FCBGA-Gehäuse-Substrat
Ajimomoto(ABF) Substrate

Ajimomoto(ABF) Substrat
BGA Substrate

BGA-Substrat
IC Substrate

IC-Substrat

Telefon +86 0755 85241496

WhatsApp (Englisch) +8615014077679

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