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What is Flip Chip Packaging Substrate?

2023-12-05 أخبار الشركة / خبر / اخطار / أخبار التجارة

Flip Chip Packaging Substrate Manufacturers and Flip Chip Packaging prototypes up to mid-volume production. High speed material packaging substrate manufacturing. Advanced packaging production process. Flip Chip Packaging Substrate is an advanced integrated circuit packaging technology that is widely used in the field of microelectronic equipment manufacturing. This technology improves circuit…

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What is a substrate materials for optical packaging?

2023-12-04 أخبار الشركة / خبر / اخطار / أخبار التجارة

We are a professional Substrate materials for optical packaging. we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. Substrate materials for optical packaging encompass the fundamental elements utilized in the production and integration of optical components. These materials play a pivotal role in determining…

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What is a substrate in packaging?

2023-12-01 أخبار الشركة / خبر / اخطار / أخبار التجارة

We are a professional Substrate in packaging, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. Packaging substrates, as an integral part of modern electronic equipment, are key elements that connect, support and protect electronic components. In this high-tech era, we usually talk about…

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Flex-Rigid BGA Substrate

2023-11-30 أخبار الشركة / خبر / اخطار / أخبار التجارة

Flex-Rigid BGA Substrate Vender. We have made the Rigid-Flex BGA substrates. the BGA package substrate use the BT base and flex(PI) base.Advanced packaging substrate production process. Packaging substrates, as core components of electronic devices, play a key role in protecting and supporting electronic components. In this complex and critical area,…

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What is semiconductor packaging substrates?

2023-11-29 أخبار الشركة / خبر / اخطار / أخبار التجارة

Semiconductor packaging substrates fabrication. we mainly produce semiconductor substrate from 2 طبقة إلى 20 الطبقات, ultra-small trace and spacing packaging substrate. High speed and high frequency materials, or other types of low CTE materials. Semiconductor packaging substrates are a vital component of modern electronic devices. These substrates act as a…

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What is IC Package Substrate?

2023-11-28 أخبار الشركة / خبر / اخطار / أخبار التجارة

Process flow ic package substrate fabrication. the Package Substrate will be made with BT Base, Rogers Bse, Showa Denko and Ajinomoto High speed materials. or other types high speed materials and high frequency materials. IC Package Substrate Fabrication (integrated circuit packaging substrate manufacturing) is a vital part of the modern…

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