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Ajinomoto GZ41R2H package substrate Manufacturer

2024-05-03 أخبار الشركة / خبر / اخطار / أخبار التجارة

Ajinomoto GZ41R2H package substrate Manufacturer. ABF package substrates and FC BGA package substrates producer, We offer High speed and high frequency material BGA packaging substrate from 2 طبقة إلى 22 الطبقات. Today, with the increasing development of electronic equipment, Ajinomoto GZ41R2H packaging substrate is playing an increasingly important role as…

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IPC Class III PCB Manufacturer

2024-05-03 أخبار الشركة / خبر / اخطار / أخبار التجارة

IPC Class III PCB Manufacturer, Military PCB, Aerospace PCB, Satellites PCB, we mainly produce ultra-small bump pitch and ultra-small trace Military substrate from 2 طبقة إلى 50 الطبقات. في المعدات الإلكترونية الحديثة, IPC Class III PCB (لوحة الدوائر المطبوعة) plays a vital role. They are not only the foundation of…

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Showa Denko MCL-E-770G package substrate Manufacturer

2024-05-02 أخبار الشركة / خبر / اخطار / أخبار التجارة

Showa Denko MCL-E-770G package substrate Manufacturer. FC BGA package substrates and ABF package substrates Vendor, We use advanced Msap and Sap technology to produce the High multilayer interconnection FC BGA substrates from 4 طبقة إلى 22 الطبقات. In today's digital age, the demands and complexity of electronic devices continue to…

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Ultrathin Antenna PCB Manufacturer

2024-05-02 أخبار الشركة / خبر / اخطار / أخبار التجارة

Ultrathin Antenna PCB Manufacturer. RF Antenna PCBs and High frequency Antenna PCBs Vendor, We offer HDI Antenna PCBs, or Cavity Antenna PCBs from 2 طبقة إلى 30 الطبقات. We will produce such PCB according to the material you specify. With the rapid development of modern communication technology, more and more…

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Radio Frequency Cavity PCB Manufacturer

2024-05-01 أخبار الشركة / خبر / اخطار / أخبار التجارة

Radio Frequency Cavity PCB Manufacturer. High speed and high frequency material Cavity PCBs, or Cavity BGA packaging substrate Vendor. Advanced Cavity production process. In the context of today's continuous development of electronic technology, the role of RF cavity PCB manufacturers in the electronics industry has become increasingly important. RF cavity…

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Ajinomoto GXT31R2 package substrate Manufacturer

2024-05-01 أخبار الشركة / خبر / اخطار / أخبار التجارة

Ajinomoto GXT31R2 package substrate Manufacturer, ABF package substrates and FC BGA package substrates Vendor, we mainly produce 4 طبقة إلى 22 layers ultra-small bump pitch FC BGA substrate, ultra-small trace and spacing. In today's high-tech field, Ajinomoto GXT31R2 Package Substrate manufacturer plays a vital role. These manufacturers use advanced technology…

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