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Ultrathin BT PCB Manufacturing

2024-03-17 أخبار الشركة / خبر / اخطار / أخبار التجارة

Ultrathin BT PCB Manufacturing. Ultrathin/extra small spacing BT LED PCBs, Ultrathin package substrates. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate manufacturer . In today's electronics industry, ultra-thin Bluetooth PCB has become an indispensable core component of many innovative products. This article will lead you to…

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What is BT laminate substrate?

2024-03-16 أخبار الشركة / خبر / اخطار / أخبار التجارة

Bt laminate substrate manufacturing. BT resin has a wide range of materials, we can use the BT base to make the Mini LED PCBs. we also have used the BT base produce the BGA/IC package substrates from 2 طبقة إلى 20 الطبقات. BT laminated substrate, full name Bismaleimide Triazine, is…

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What is Mini LED PCB?

2024-03-15 أخبار الشركة / خبر / اخطار / أخبار التجارة

Mini led pcb manufacturing. Features: microtrace(30um), ultra-small spacing(30um), ultra-thin finished board thickness, finished board surface flatness is higher, easier to assemble components. Mini LED PCB (لوحة الدوائر المطبوعة) is an innovative product that combines micro LED (Light-Emitting Diode) and circuit board technology. This circuit board enables a highly integrated display…

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Rigid-flex BGA Substrate

2024-03-14 أخبار الشركة / خبر / اخطار / أخبار التجارة

Rigid-flex BGA substrate Manufacture. the Rigid-flex BGA substrate will be made with Flex base materials and hard boards base materials. you can use the High speed materials or other types materials. Features: Ultra-small gap. Rigid-Flex BGA Substrates, translated as rigid-flexible BGA substrate in Chinese, is an innovative PCB engineering solution…

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Semiconductor BGA substrate Manufacturer

2024-03-13 أخبار الشركة / خبر / اخطار / أخبار التجارة

Semiconductor BGA substrate Manufacturer. the Package Substrate will be made with BT,روجرز, Isola, Showa Denko and Ajinomoto High speed materials. Semiconductor BGA Substrate, the semiconductor BGA substrate, is a key electronic component that plays an important role in supporting and connecting semiconductor devices. It provides solid physical support and reliable…

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FC BGA substrate design rules

2024-03-12 أخبار الشركة / خبر / اخطار / أخبار التجارة

FC BGA substrate design rules and Semiconductor FC BGA substrate Firm. High multilayer FC BGA package substrate design reference rules. and High speed and high frequency material packaging substrate manufacturing. Advanced packaging manufacturing technique. Semiconductor FC BGA (ball ball array) substrate is a technology component that plays a key role…

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