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Package substrate materials introduction

2023-11-17 أخبار الشركة / خبر / اخطار / أخبار التجارة

Package substrate materials introduction and package substrate manufacture. You can use BT series core, High frequency series Core, high speed series Core materials. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 2 to 20 الطبقات. In the manufacturing of modern electronic devices, packaging substrates play a…

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What is Microtrace Package Substrates?

2023-11-16 أخبار الشركة / خبر / اخطار / أخبار التجارة

Microtrace Package Substrates Manufacturing, we mainly produce ultra-small bump pitch substrate with 100um, Microtrace and spacing packaging substrate with 9um to 30um. and from 30 to 80um gap substrates will be more easy manufacturing. In today's highly developed electronic field, 30 micron substrates play a vital role. This thin yet…

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More lower CTE Package Substrate Prototypes

2023-11-15 أخبار الشركة / خبر / اخطار / أخبار التجارة

More lower CTE Package Substrate Prototypes, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and HDI PCBs. Production of high multilayer packaging substrates with high speed and high frequency materials. The coefficient of thermal expansion (CTE) is a pivotal concept within the electronics industry, exerting…

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What is Substrate Layer Stackup?

2023-11-14 أخبار الشركة / خبر / اخطار / أخبار التجارة

Package substrate Supplier. We offer FCBGA package substrates from prototypes up to mid-volume production. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 الطبقات. Packaging substrates, as a key component of modern electronic equipment, play a vital role. It not only provides mechanical support…

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What is package substrate?

2023-11-13 أخبار الشركة / خبر / اخطار / أخبار التجارة

Professional Package substrate manufacturer, We offer Package substrate prototypes up to mid-volume production. we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and HDI PCBs. The packaging substrate, referred to as PCB (لوحة الدوائر المطبوعة), is a key electronic component, usually made of insulating materials with…

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What is semiconductor organic packaging substrates?

2023-11-10 أخبار الشركة / خبر / اخطار / أخبار التجارة

Semiconductor organic packaging substrates manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 2 to 20 الطبقات. In today's digital era, semiconductor technology has assumed an indispensable role in our daily lives. From smartphones to electric cars, nearly all electronic devices rely on semiconductor chips. To…

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