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ABF GZ41R2H Package Substrates Manufacturer

2024-05-15 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

ABF GZ41R2H Package Substrates Manufacturer , we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. With the continuous advancement of technology, electronic products are becoming more and more complex, and the development of PCB (Printed Circuit Board) technology is an important driving force for…

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Glass Materials Package Substrates Manufacturer

2024-05-15 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Glass Materials Package Substrates Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. In today's electronics industry, Glass Materials Package Substrates play a crucial role. As one of the core components of modern electronic equipment, they are not only the basis for…

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Multi-Chip FC-BGA Substrates Manufacturer

2024-05-14 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Multi-Chip FC-BGA Substrates Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18, In the design of modern electronic equipment, PLATINE (Printed Circuit Board) plays a crucial role. With the continuous development of technology, multi-core FC-BGA substrate, as a new circuit board design solution,…

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CPU Ball Package Substrates Manufacturer

2024-05-14 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

CPU Ball Package Substrates Manufacturer . the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other. In modern electronic equipment, CPU Ball Package Substrates are a key component to ensure efficient operation of the equipment. These substrates are precision manufactured to provide stable support and…

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Ultrathin FC-LGA Substrates Manufacturer

2024-05-13 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Ultrathin FC-LGA Substrates Manufacturer.High speed and high frequency material packaging substrate Manufacturer. Advanced packaging substrate. With the rapid development of electronic equipment, the demand for thinner, more flexible circuit boards is also increasing. In this context, ultra-thin FC-LGA (Fine-Pitch Land Grid Array) substrate has become the key to leading circuit…

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Minimum Clearance PCB Manufacturer

2024-05-13 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Minimum Clearance PCB Manufacturer , we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate. With the continuous development of electronic equipment, PLATINE (Printed Circuit Board), as one of its core components, plays a vital role. In modern electronic manufacturing, minimum clearance PCB has become one of…

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