Professioneller Hersteller von BGA-Verpackungssubstraten.

Tel:+086 0755 85241496 |

CompanyNews-Page20of294-ProfessionalFlip-ChipPackagingSubstrateSupplier-Page20

Unternehmensnachrichten

Heim

Unternehmensnachrichten

RF Modules Substrate Manufacturer

2024-04-27 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

RF Modules Substrate Manufacturer. High speed and high frequency material BGA packaging substrate Vendor. we offer advanced RF BGA packaging substrate from 2 layer to 22 layers. the best smallest trace and gap are 9um/9um. In today's electronic devices, RF modules play an increasingly important role. From smartphones to Internet…

Read more
Metal Core PCB Manufacturer

2024-04-27 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Metal Core PCB Manufacturer, We are 100um to 7200um Heavy copper PCBs and Extra thick copper PCBs Vendor, we offer the Metal core PCBs from 1 layer to 20 layers. In the fast-paced world of modern electronics, Metal Core Printed Circuit Boards (PCBs) have emerged as the cornerstone of innovation.…

Read more
Microtrace BGA substrates Manufacturer

2024-04-26 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Microtrace BGA substrates Manufacturer,Microgap BGA substrates, We use advanced Msap and Sap technology to produce the High multilayer interconnection BGA substrates from 4 to 22 layer. To use the High frequency and high speed materials. In today's era of rapid technological development, PLATINE (Printed Circuit Board) has become the core…

Read more
Ultrathin LED PCB Manufacturer

2024-04-26 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Ultrathin LED PCB Manufacturer. We can produce 2 layer Ultrathin hard PCB thickness with 3MIL(75um), 4mil(100um), 5mil(127um). if you want do make 4 layer Ultrathin hard PCB,the finished thickness will be about 7mil or 8mil.We will produce PCB according to the thickness you require. In today's digital world, the manufacturing…

Read more
RF High Frequency Flip Chip Substrate Manufacturer

2024-04-25 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

RF High Frequency Flip Chip Substrate Manufacturer. RF BGA package substrates Vendor, we produce the best samllest bump pitch with 100um, the best smallest trace and spacing are 9um. To use the High frequency and high speed materials, or other types BGA substrates materials. As a core component of modern…

Read more
Military PCB Manufacturer

2024-04-25 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Military PCB Manufacturer. Military boards, Aviation PCBs, SATCOM PCBs Vendor, We offer IPC Class III PCBs from 2 layer to 50 layers. In modern military equipment, electronic components play an increasingly critical role. And one of the most important components is the printed circuit board (PLATINE). As the foundation for…

Read more

+86 0755 85241496

business@qycltd.com

Angebot anfordern ?