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3D Ceramic Packages Substrate

2024-03-25 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

3D Ceramic Packages Substrate manufacturing. Advanced 3D production process technology. we made the Ceramic Packages Substrate with 3D process. In the manufacturing of today's high-tech electronic equipment, 3D ceramic packaging substrates, as an advanced technology, are gradually becoming the mainstream choice in the industry. This packaging technology not only enables…

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Mini Ceramics PCB

2024-03-25 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Professional Mini Ceramics PCB manufacturing, Ultra-small bump pitch Ceramics substrate, ultra-small trace and spacing Ceramics substrate. We offer Mini Ceramics PCB and Ceramics package substrates from 2 layer to 22 layers. In the field of modern electronics, PLATINE (Printed Circuit Board) plays a vital role. As the basic structure that…

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Mixed dielectric PCB

2024-03-25 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Mixed dielectric PCB manufacturing.High speed and high frequency Mixed dielectric PCBs, or other types Mixed dielectric PCBs. we offer HDI Mixed dielectric layer PCB from 4 layer to 50 layers. Mixed media PCB (Printed Circuit Board) plays an important role in modern electronic equipment. By combining the characteristics of different…

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Embedded IC PCB

2024-03-24 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Embedded IC PCB manufacturing. Open Embedded cavity PCBs, the PCBs will be made with cavities, open cavity on the top layer or bottom layer. or in the Middle of each layer. we called it buried cavity PCBs. We can use high frequency and high speed or ceramic materials for production.…

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Microvia Substrates manufacturing

2024-03-23 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Microvia Substrates manufacturing.High speed and high frequency material packaging substrate or HDI PCBs. Advanced Microvia Substrates production technology process. we offer Microvia Substrates from 4 layer to 50 layers. Microvia Substrates play a key role in the modern electronics industry. As an important part of connecting and supporting electronic components,…

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Embedded cavity PCB

2024-03-22 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Embedded cavity PCB manufacturing, Open cavity(slot) on the PCBs, or make the step cavity on the PCBs, Put the IC or other components and parts in the cavity area. we offer Cavity PCBs from 4 layer to 30 layers. We will produce this Cavity PCBs according to the material you…

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