Professioneller Hersteller von BGA-Verpackungssubstraten.

Tel:+086 0755 85241496 |

CompanyNews-Page36of294-ProfessionalFlip-ChipPackagingSubstrateSupplier-Page36

Unternehmensnachrichten

Heim

Unternehmensnachrichten

FC-CSP Substrates Manufacturer

2024-02-22 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

FC-CSP Substrates Manufacturer. We use advanced Msap and Sap technology to manufacture the High multilayer interconnection FC-CSP substrates from 2 to 20layers, use the High speed and high frequency materials. Have you ever been curious about the packaging technologies used in electronic devices? Today, let us explore an advanced packaging…

Read more
CPCORE Structure substrates Manufacturer

2024-02-21 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

CPCORE Structure substrates Manufacturer. the Package Substrate will be made with BT base and Showa Denko and Ajinomoto High speed materials. or other types Structure Structure materials. Packaging substrates are essential components in contemporary electronic devices, serving crucial functions in supporting, interconnecting, and safeguarding chips and other electronic elements. As…

Read more
SHDBU Substrates Manufacturer

2024-02-20 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

SHDBU Substrates Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate company. Packaging substrates are essential elements within the contemporary electronics sector, serving as fundamental materials that facilitate the connection between chips and external circuits. They bear the dual responsibilities of structural support and signal transmission.…

Read more
High Speed package Substrate

2024-02-19 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

High Speed package Substrate Manufacturer. High Speed material has BT series materials, ABF series materials. We use advanced Msap and Sap technology to manufacture the High multilayer interconnection High Speed substrates from 2 to 20 layers. The passage discusses the importance of high-speed packaging substrates in electronic communications. These substrates are…

Read more
High Frequency package Substrate Manufacturer

2024-02-18 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

High Frequency package Substrate Manufacturer. Some package Substrate will be made with High Frequency materials. Such as: Rogers materials package Substrate. or rogers cavity package substrate. Most of the Package Substrate will be made with BT base, Some were made with Showa Denko and Ajinomoto High speed materials. we can…

Read more
High precision packaging substrate Manufacturer

2024-02-17 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

High precision packaging substrate Manufacturer. We use the mSap and Sap Advanced production technology to produce the Package Substrate. and the packaging substrate will be made with BT, and Showa Denko and Ajinomoto base materials. or other types High speed materials, or maybe high frequency materials. This passage emphasizes the…

Read more

+86 0755 85241496

business@qycltd.com

Angebot anfordern ?