Professioneller Hersteller von BGA-Verpackungssubstraten.

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Flip Chip Package Substrate Firm

2023-12-13 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Flip Chip Package Substrate Firm we have produced the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing. In the ever-evolving field of PCB engineering, flip chip packaging substrates have…

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What is the definition of IC Substrate?

2023-12-12 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

IC Substrate Firm. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials. In today's electronic field where technology is changing with each passing day, IC-Substrat (integrated circuit substrate) plays an indispensable role. IC Substrate is a specially designed substrate…

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What is ABF Substrate?

2023-12-11 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Professional ABF Substrate Supplier, The package substrate were made with Ajinomoto base materials: they are GX92R, GXT31R2,GZ41R2H,GL102R8HF. and other types material. ABF Substrate (Build-Up Film substrate containing colloidal copper phosphate) is an advanced material in the field of PCB engineering. The technological innovation behind it provides strong support for the…

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FCBGA Packaging Service

2023-12-08 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

FCBGA Packaging Service and FCBGA Substrate Manufacturer. We use advanced Msap and Sap technology to build a 20 layers FCBGA Packaging substrates. the best smallest trace and spacing are 15um/15um. it was made with ABF base materials. FCBGA Substrate, Flip-Chip Ball Grid Array Substrate, as a cutting-edge packaging technology, plays…

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What is FCBGA Packaging Substrate?

2023-12-07 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

FCBGA Packaging Substrate Vender . We use advanced Msap and Sap technology to build the FCBGA packaging substrates from 4 layer to 20 layers, High quality base materials and fast shipping time. we also do the packaging service. As an advanced packaging technology, FCBGA packaging substrate (Fine-pitch Ball Grid Array)…

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Package Substrate Prototype

2023-12-06 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Package Substrate Prototype. We use advanced Msap and Sap technology to build the Substrates and Package Prototype , High multilayer interconnection substrates from 2 to 20 layers. Verpackungs-Substrat, as we can surmise from its name, is a key electronic element. But what is it? On the big stage of…

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