Professioneller Hersteller von BGA-Verpackungssubstraten.

Tel:+086 0755 85241496 |

TradeNews-Page18of307-ProfessionalFlip-ChipPackagingSubstrateSupplier-Page18

Fachnachrichten

Heim

Fachnachrichten

Ajinomoto GZ41R2H package substrate Manufacturer

2024-05-03 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Ajinomoto GZ41R2H package substrate Manufacturer. ABF package substrates and FC BGA package substrates producer, We offer High speed and high frequency material BGA packaging substrate from 2 layer to 22 layers. Today, with the increasing development of electronic equipment, Ajinomoto GZ41R2H packaging substrate is playing an increasingly important role as…

Read more
IPC Class III PCB Manufacturer

2024-05-03 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

IPC Class III PCB Manufacturer, Military PCB, Aerospace PCB, Satellites PCB, we mainly produce ultra-small bump pitch and ultra-small trace Military substrate from 2 layer to 50 layers. In modern electronic equipment, IPC Class III PCB (Printed Circuit Board) plays a vital role. They are not only the foundation of…

Read more
Showa Denko MCL-E-770G package substrate Manufacturer

2024-05-02 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Showa Denko MCL-E-770G package substrate Manufacturer. FC BGA package substrates and ABF package substrates Vendor, We use advanced Msap and Sap technology to produce the High multilayer interconnection FC BGA substrates from 4 layer to 22 layers. In today's digital age, the demands and complexity of electronic devices continue to…

Read more
Ultrathin Antenna PCB Manufacturer

2024-05-02 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Ultrathin Antenna PCB Manufacturer. RF Antenna PCBs and High frequency Antenna PCBs Vendor, We offer HDI Antenna PCBs, or Cavity Antenna PCBs from 2 layer to 30 layers. We will produce such PCB according to the material you specify. With the rapid development of modern communication technology, more and more…

Read more
Radio Frequency Cavity PCB Manufacturer

2024-05-01 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Radio Frequency Cavity PCB Manufacturer. High speed and high frequency material Cavity PCBs, or Cavity BGA packaging substrate Vendor. Advanced Cavity production process. In the context of today's continuous development of electronic technology, the role of RF cavity PCB manufacturers in the electronics industry has become increasingly important. RF cavity…

Read more
Ajinomoto GXT31R2 package substrate Manufacturer

2024-05-01 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

Ajinomoto GXT31R2 package substrate Manufacturer, ABF package substrates and FC BGA package substrates Vendor, we mainly produce 4 layer to 22 layers ultra-small bump pitch FC BGA substrate, ultra-small trace and spacing. In today's high-tech field, Ajinomoto GXT31R2 Package Substrate manufacturer plays a vital role. These manufacturers use advanced technology…

Read more

+86 0755 85241496

business@qycltd.com

Angebot anfordern ?