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What is a semiconductor packaging substrate?

2024-01-17 Company News / News / Notification / Trade News

Semiconductor package substrate quote. the Package Substrate will be made with Rogers base, BT base and Showa Denko and Ajinomoto High speed materials. In the dynamic landscape of contemporary electronic equipment, semiconductor packaging substrates have emerged as an essential and pivotal element within the rapidly evolving electronics industry. Serving as…

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What is ceramic substrate?

2024-01-16 Company News / News / Notification / Trade News

Advanced Ceramic substrate supplier, we mainly produce ultra-small bump pitch Ceramic substrate, ultra-small trace Ceramic substrate and Ceramic PCBs. In the contemporary realm of electronic engineering, cutting-edge ceramic packaging substrates are emerging as a revolutionary element in PCB design. Acting as the crucial link between semiconductor chips and the broader PCB,…

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What is an advanced semiconductor substrate?

2024-01-15 Company News / News / Notification / Trade News

Semiconductor substrate manufacture. the Package Substrate will be made with BT base, Showa Denko and Ajinomoto High speed materials. They go beyond being mere physical supports, serving as essential mediums for transmitting signals and energy between semiconductor chips and PCB structures. Distinguished from traditional printed circuit boards (PCBs), these substrates…

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What is Semiconductor Substrate?

2024-01-12 Company News / News / Notification / Trade News

Advance Semiconductor substrate Vender. the Package Substrate will be made with BT, Showa Denko and Ajinomoto High speed materials. Marked by an unwavering commitment to meeting the pressing demands for miniaturization, high performance, and heightened reliability in modern electronic devices, the Advanced Semiconductor Substrate introduces cutting-edge manufacturing processes and materials.…

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What is Rigid-Flex BGA Substrate?

2024-01-11 Company News / News / Notification / Trade News

Rigid-flex BGA substrate Supplier. the Package Substrate will be made with PI(Flex base materials) and BT, Rogers or Showa Denko and Ajinomoto High speed materials. The ingenious combination of these elements allows the substrate to flex within defined spatial constraints, significantly enhancing the adaptability of electronic product design. Conventional rigid…

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What are advanced packaging substrates?

2024-01-10 Company News / News / Notification / Trade News

Advanced packaging substrate manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace and spacing are 9um. In contemporary PCB (Printed Circuit Board) engineering, an Advanced Packaging Substrate refers to an electronic packaging substrate that seamlessly integrates both rigid and flexible materials. The definition and…

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