Professioneller Hersteller von BGA-Verpackungssubstraten.

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Where to Buy the Package Substrate?

2023-11-06 Nachrichten / Fachnachrichten

High-precision Package substrate manufacturer. We use advanced Msap and Sap technology to produce High multilayer interconnection substrates from 2 to 20 layers. In modern electronic equipment, packaging substrate (Verpackungs-Substrat) plays a vital role. It is the support and connection hub of electronic components and plays a key role. To…

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What is the Chip Package Substrate?

2023-11-03 Nachrichten / Fachnachrichten

Chip Package Substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um,and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing. In the contemporary digital era, electronic devices have seamlessly woven themselves into every facet…

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What is BT Package Substrate?

2023-11-03 Unternehmensnachrichten / Nachrichten / Benachrichtigung / Fachnachrichten

BT package substrate Manufacture. We use advanced Msap and Sap technology to build High multilayer interconnection substrates from 2 to 20 layers. The semiconductor industry has consistently maintained its position at the vanguard of rapid development and innovation, with semiconductor packaging substrates assuming a pivotal role in this trajectory. These…

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BGA Package Substrate Vender

2023-11-02 Nachrichten / Fachnachrichten

BGA Package Substrate Vender, we build ultra-small bump pitch IC/BGA substrate from 2 layer to 20 layers, ultra-small trace and spacing packaging substrate and smallest gap PCBs. At the forefront of modern technology, the electronics industry relies heavily on various essential components. Among these, packaging substrates and printed circuit boards…

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4-Layer Package Substrate

2023-11-02 Fachnachrichten

4 layer Package Substrate Manufacturing, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and microtrace HDI PCBs. FCBGA package and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 layers,The core of electronic devices is constantly…

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Package Substrate PCB Manufacturing

2023-11-01 Fachnachrichten

Package Substrate PCB Manufacturing. the Package Substrate will be made with BT Base materials, Rogers base materials, Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials.The sophistication and performance of electronic devices depend not only on the design of their internal circuits, but…

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