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What is the Flip-Chip Package Substrate ?

2023-10-27 Fachnachrichten

Professional Flip-Chip Package Substrate manufacturing, ultra-small pitch Bump is 100um, ultra-small trace and pitch 10um/10um, high frequency and high speed material packaging substrates. Flip Chip Package Substrate is a key semiconductor packaging technology that plays an important role in the electronics industry. This article will introduce you to the key…

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