Professional BGA Packaging Substrate Manufacturer.

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Professional Flip-Chip Packaging Substrate Supplier

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3DICPackageSubstrate-ProfessionalFlip-ChipPackagingSubstrateSupplier

3D IC Package Substrate

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Products

3D IC Package Substrate

3D IC Package Substrate

Package Substrates
Semiconductor packaging substrate
High frequency package substrate
Ceramic packaging substrate
Small Spacing Substrates
Cavity packaging substrate
High speed substrate
Rogers PCB
PGA Package Substrate
SOP Package Substrate
SIP Package Substrate
CSP Package Substrate
POP Package Substrate
WLP Package Substrate

CSP Package Substrate

SOP Package Substrate

ABOUT US

SHENZHEN QYC CO.,LTD

We mainly produce 2-layer to 20-layer packaging substrate, minimum trace 9um, minimum spacing 9um. the best smallest via size are 50um. The Min Bomp Pithc are 100um. and most of the packaging substrate materials we used from Japan. South Korea.The material quality of the substrate is very stable.

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PRODUCTS

Flip-Chip Package Substrate

Package Substrate

FCBGA Packaging Substrate

Semiconductor packaging substrate

Ceramic packaging substrate

Cavity packaging substrate

PGA Package Substrate

SOP Package Substrate

SIP Package Substrate

CONTACT US

Phone: +86 0755 85241496

E-mail: business@qycltd.com

Skype: Henrychinasz

WhatsAPP: +8615014077679

Address: Oriental Business Building, 182 Baomin 2nd Road, Xixiang Street, Baoan District, Shenzhen, Guangdong,China

Copyright © 2022 SHENZHEN QYC CO.,LTD All Rights Reserved.

+86 0755 85241496

business@qycltd.com

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