Professioneller Hersteller von BGA-Verpackungssubstraten.

Tel:+086 0755 85241496 |

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Advanced BGA/IC Substrate

  1. Heim
  2. Produkte
  3. Advanced BGA/IC Substrate
Ultra-small spacing PCB

Leiterplatte mit ultrakleinem Abstand
IC Substrate

IC-Substrat
BGA Substrate

BGA-Substrat
Ajimomoto(ABF) Substrate

Ajimomoto(ABF) Substrat
FCBGA package substrate

FCBGA-Gehäuse-Substrat
FCBGA package Substrate

FCBGA-Paket Substrat
Flip-Chip Packaging Substrate

Flip-Chip-Verpackungssubstrat
Packaging Substrate

Verpackungssubstrat

Telefon +86 0755 85241496

WhatsApp (Englisch) +8615014077679

E-Mail business@qycltd.com

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