Professioneller Hersteller von BGA-Verpackungssubstraten.

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BTPackageSubstrate-ProfessionalFlip-ChipPackagingSubstrateSupplier

BT Package Substrate

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  3. BT Package Substrate
QFN Package

QFN-Paket
DIP Package Substrate

DIP-Gehäuse-Substrat
LCC Package Substrate

LCC-Gehäuse-Substrat
Ball Grid Array Package Substrate

Ball Grid Array Package Substrat
PGA Package Substrate

PGA-Gehäuse-Substrat
SOP Package Substrate

SOP-Gehäuse-Substrat
SIP Package Substrate

SIP-Gehäuse-Substrat
CSP Package Substrate

CSP-Gehäuse-Substrat
POP Package Substrate

POP-Gehäuse-Substrat
WLP Package Substrate

WLP-Gehäuse-Substrat
2D IC Package Substrate

2D-IC-Gehäuse-Substrat
3D IC Package Substrate

3D-IC-Gehäuse-Substrat

Telefon +86 0755 85241496

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