Professioneller Hersteller von BGA-Verpackungssubstraten.

Tel:+086 0755 85241496 |

CavityPackagingSubstrate-ProfessionalFlip-ChipPackagingSubstrateSupplier

Cavity Packaging Substrate

  1. Heim
  2. Produkte
  3. Cavity Packaging Substrate
DIP Package Substrate

DIP-Gehäuse-Substrat
Ball Grid Array Package Substrate

Ball Grid Array Package Substrat
PGA Package Substrate

PGA-Gehäuse-Substrat
SOP Package Substrate

SOP-Gehäuse-Substrat
WLP Package Substrate

WLP-Gehäuse-Substrat
2D IC Package Substrate

2D-IC-Gehäuse-Substrat
3D IC Package Substrate

3D-IC-Gehäuse-Substrat
Cavity packaging substrate

Substrat für Hohlraumverpackungen
FCBGA package substrate

FCBGA-Gehäuse-Substrat
FCBGA package Substrate

FCBGA-Paket Substrat
Flip-Chip Packaging Substrate

Flip-Chip-Verpackungssubstrat
Packaging Substrate

Verpackungssubstrat

Telefon +86 0755 85241496

WhatsApp (Englisch) +8615014077679

E-Mail business@qycltd.com

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