Fabricant professionnel de substrats d’emballage BGA.

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Fabricant de substrats de boîtier de puce

2024-05-09 Actualités de l’entreprise / Nouvelles / Notification / Actualités commerciales

Fabricant de substrats de boîtier de puce, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate. Chip packaging substrates play a vital role in modern electronics. As core components of electronic equipment, they carry the important functions of circuits and provide stable circuit connections and support for various applications.…

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2024-05-09 Actualités de l’entreprise / Nouvelles / Notification / Actualités commerciales

Fabricant de PCB RF ultraminces . Nous pouvons produire le meilleur petit pas de bosse avec 100um, Les meilleures plus petites traces sont 9um. et le plus petit écart. Avec le développement rapide de la science et de la technologie, Les exigences en matière d’équipements électroniques ne cessent également d’augmenter. À cette époque de recherche continue de plus minces,…

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Fabricant de substrats de boîtier de processeur AI

2024-05-08 Actualités de l’entreprise / Nouvelles / Notification / Actualités commerciales

Fabricant de substrats de boîtier de processeur AI . We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4, In today's electronic field, AI processor packaging substrate plays an indispensable role. As core components that connect and support AI chips, they provide a solid foundation for the performance and functionality…

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Ajinomoto GX92 Package Substrate Manufacturer

2024-05-08 Actualités de l’entreprise / Nouvelles / Notification / Actualités commerciales

Ajinomoto GX92 Package Substrate Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials. In today's electronic field, Ajinomoto GX92 packaging substrate plays a vital role. It not only connects various electronic components, but is also responsible for transmitting electrical signals. This article will delve…

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RF/microwave PCB Manufacturer

2024-05-07 Actualités de l’entreprise / Nouvelles / Notification / Actualités commerciales

RF/microwave PCB Manufacturer.High speed and high frequency material packaging substrate Manufacturer. Advanced packaging substrate production. With the rapid development of wireless communication technology, RF (radio frequency) and microwave circuit boards (PCB) have become indispensable key components in modern electronic equipment. This article will delve into the importance of RF/microwave PCBs…

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Ultra-thin BGA Substrate Manufacturer

2024-05-07 Actualités de l’entreprise / Nouvelles / Notification / Actualités commerciales

Ultra-thin BGA Substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate. With the rapid development of electronic technology, the smart devices around us are becoming more and more compact and exquisite, but their functions are becoming increasingly powerful. In this ubiquitous electronic revolution, ultra-thin…

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