Fabricant professionnel de substrats d’emballage BGA.

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Advanced BGA/IC Substrate

  1. Domicile
  2. Produits
  3. Advanced BGA/IC Substrate
Ultra-small spacing PCB

PCB à espacement ultra-petit
IC Substrate

Substrat IC
BGA Substrate

Substrat BGA
Ajimomoto(ABF) Substrate

Ajimomoto(ABF) Substrat
FCBGA package substrate

Substrat de boîtier FCBGA
FCBGA package Substrate

Substrat de boîtier FCBGA
Flip-Chip Packaging Substrate

Substrat d’emballage Flip-Chip
Packaging Substrate

Substrat d’emballage

Téléphone +86 0755 85241496

WhatsApp +8615014077679

Courriel business@qycltd.com

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