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Ajinomoto GZ41R2H package substrate Manufacturer

2024-05-03 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Ajinomoto GZ41R2H package substrate Manufacturer. ABF package substrates and FC BGA package substrates producer, We offer High speed and high frequency material BGA packaging substrate from 2 layer to 22 Strati. Today, with the increasing development of electronic equipment, Ajinomoto GZ41R2H packaging substrate is playing an increasingly important role as…

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IPC Class III PCB Manufacturer

2024-05-03 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

IPC Class III PCB Manufacturer, Military PCB, Aerospace PCB, Satellites PCB, we mainly produce ultra-small bump pitch and ultra-small trace Military substrate from 2 layer to 50 Strati. In modern electronic equipment, IPC Class III PCB (Printed Circuit Board) plays a vital role. They are not only the foundation of…

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Showa Denko MCL-E-770G package substrate Manufacturer

2024-05-02 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Showa Denko MCL-E-770G package substrate Manufacturer. FC BGA package substrates and ABF package substrates Vendor, We use advanced Msap and Sap technology to produce the High multilayer interconnection FC BGA substrates from 4 layer to 22 Strati. In today's digital age, the demands and complexity of electronic devices continue to…

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Ultrathin Antenna PCB Manufacturer

2024-05-02 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Ultrathin Antenna PCB Manufacturer. RF Antenna PCBs and High frequency Antenna PCBs Vendor, We offer HDI Antenna PCBs, or Cavity Antenna PCBs from 2 layer to 30 Strati. We will produce such PCB according to the material you specify. With the rapid development of modern communication technology, more and more…

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Radio Frequency Cavity PCB Manufacturer

2024-05-01 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Radio Frequency Cavity PCB Manufacturer. High speed and high frequency material Cavity PCBs, or Cavity BGA packaging substrate Vendor. Advanced Cavity production process. In the context of today's continuous development of electronic technology, the role of RF cavity PCB manufacturers in the electronics industry has become increasingly important. RF cavity…

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Ajinomoto GXT31R2 package substrate Manufacturer

2024-05-01 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Ajinomoto GXT31R2 package substrate Manufacturer, ABF package substrates and FC BGA package substrates Vendor, we mainly produce 4 layer to 22 layers ultra-small bump pitch FC BGA substrate, ultra-small trace and spacing. In today's high-tech field, Ajinomoto GXT31R2 Package Substrate manufacturer plays a vital role. These manufacturers use advanced technology…

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