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What is Ceramic Packaging Substrate?

2023-12-29 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Ceramic Package Substrate Manufacturer. Ceramic 96 AL2O3 Substrate amd Ceramic ALN Substrate materials. We can use this base materials to make the PCBs. or Ceramic Package Substrates. High quality and fast shipping time. Primarily, the outstanding rigidity of ceramic packaging substrates is instrumental in maintaining structural stability within high-density circuit…

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What is Semiconductor BGA Substrate?

2023-12-28 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Semiconductor BGA Substrate Supplier. High speed and high frequency material packaging substrate manufacturing. We have a professional production team, advanced production equipment. Semiconductor Ball Grid Array Substrate (Substrato BGA) stands out as an advanced technology garnering considerable attention within the realm of printed circuit boards (PCBs). Distinguished by its unique…

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What is Semiconductor FC BGA Substrate?

2023-12-27 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Semiconductor FC BGA Substrate Firm, We mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate. Most of the FCBGA substrates were made with ABF base materials. The Semiconductor FC BGA substrate stands out as an exemplary manifestation of semiconductor packaging technology, seamlessly amalgamating the exceptional benefits of…

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What is Flex-Rigid Packaging Substrate?

2023-12-26 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Flex-Rigid Packaging Substrate Manufacture. Professional BGA Flex-Rigid Substrate Firm. To use the BT base to produce the Flex-Rigid BGA Substrate from 4 layer to 30 Strati. In the domain of PCB (Printed Circuit Board) engineering, the Rigid-Flex Packaging Substrate emerges as a groundbreaking substrate variant, heralding a new era in…

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What is Rigid-Flex BGA Substrate?

2023-12-25 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Rigid-Flex BGA Substrate Manufacturer. Hard board and soft board process combination. To use the BT base and Flex base produce the Rigid-Flex BGA Substrates. The advantages are Microtrace and smallest gap with 9um/9um. The Rigid-Flex BGA Substrate stands out as a cutting-edge design within advanced PCB engineering, seamlessly integrating rigid…

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What is Ceramic Packaging Substrate?

2023-12-22 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Ceramic Packaging Substrate Manufacturing, Not only to use BT base, ABF base, Rogers Base, High TG FR4 base, we also can use the Ceramic base materials to build the Packaging Substrate. Come: 96 L2O3 Ceramic Substrates, ALN Ceramic Substrates. and other types Ceramic base materials. Ceramic packaging substrates, as…

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