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What is Semiconductor Substrate?

2023-12-21 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Semiconductor Substrate Vendor . the Package Substrate will be made with BT base, Showa Denko and Ajinomoto High speed base materials.and other high speed materials. A semiconductor substrate, commonly known as a semiconductor substrate, stands as a foundational element in the realm of printed circuit board (PCB) engineering, providing a…

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What is BGA Substrate?

2023-12-20 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Professional BGA Substrate Manufacturer, Characteristic: ultra-small bump pitch, ultra-small trace and spacing. Mitsubishi BT base materials, ABF base materials, Rogers base materials. and other types materials. In today's rapidly developing field of electronic technology, Ball Grid Array (BGA) Substrate is an indispensable key circuit board component. Its unique design and…

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What is FCBGA Packaging?

2023-12-19 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Professional FCBGA Packaging Supplier, we mainly produce ultra-small bump pitch FCBGA Packaging substrate, ultra-small trace and spacing. Our company also offer FCBGA Packaging Service. In today's field of high-performance computers and communication equipment, FCBGA (Flip-Chip Ball Grid Array) Packaging technology is particularly important. As a PCB engineer with ten years…

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What is FCBGA Package?

2023-12-18 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

FCBGA Package Firm. We offer FCBGA Package Substrates and we also produce the Package Substrates from 2 layer to 20 Strati. To use the ABF base or BT base and other types Package substrates base materials. FCBGA Package, or Fine-pitch Ball Grid Array Package, is an advanced and complex packaging…

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FCBGA Package Substrate| ABF Substrate Vendors

2023-12-15 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

ABF Substrate Vendors. FCBGA Package Substrate were made with ABF(Ajinomoto) core materials. they are: GX92R,GXT31R2, GZ41R2H, GL102R8HF and others. or Showa Denko Series material. they are MCL-E-705G, MCL-E-770G, MECL-E-700G, MCL-E-795G and others. you also can use BT base. Rogers base and other types conventional material. FCBGA Package Substrate (Flip Chip Ball…

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Packaging Substrate Vendors

2023-12-14 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Packaging Substrate Vendors. High speed and high frequency material package substrate manufacturing. Advanced packaging substrate production process. In the vast world of PCB engineering, the packaging substrate emerges as a key element, spanning like a bridge across the crossroads between innovation and functionality. Its position is very important and plays…

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