Produttore professionale di substrati per imballaggio BGA.

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types of packaging substrates

2023-11-27 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Packaging Substrate Suppliers, we offer package substrate prototypes up to mid-volume production. the best samllest via size are 50um. the best smallest gap are 9um. and Minimum trace are 9um too. In today's rapidly developing electronics field, packaging substrates play a vital role, providing critical support and connections for electronic…

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Package Substrate Fabrication

2023-11-23 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Package substrate fabrication and FCBGA Packaging prototypes. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 2 to 20 Strati. As an indispensable element within contemporary electronic devices, the packaging substrate assumes a pivotal role. Primarily, it functions as a foundational support and connection platform for electronic…

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What is Package Substrate Strip?

2023-11-22 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Package substrate strip and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 Strati. In the field of modern electronics, the new concept of Package Substrate Strip technology has given rise to a series of compelling technical advantages. This innovative packaging…

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What is Package Substrate Structures?

2023-11-21 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Package substrate structure and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 2 to 20 Strati. In the booming development of the electronics industry, Package Substrate, as one of the key components, plays a pivotal role in connecting chips and circuit boards. In…

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Package Substrate Prepreg Introduction

2023-11-20 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Package substrate prepreg Introduction and Package substrate prototypes up to mid-volume production, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and microtrace HDI PCBs. In modern electronic manufacturing, Package Substrate Prepreg is a key material that plays a key role in connecting and protecting electronic…

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Package substrate materials introduction

2023-11-17 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Package substrate materials introduction and package substrate manufacture. You can use BT series core, High frequency series Core, high speed series Core materials. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 2 to 20 Strati. In the manufacturing of modern electronic devices, packaging substrates play a…

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