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Showa Denko MCL-E-795G package substrate Manufacturer

2024-05-06 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Showa Denko MCL-E-795G Package Substrate Manufacturer.High speed and high frequency material packaging substrate Manufacturer. In the field of modern electronics, MCL-E-795G packaging substrate is one of the indispensable key components. As the core building block of electronic devices, its design and manufacturing are critical to ensuring the device's high performance,…

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Radar/Antenna substrate Manufacturer

2024-05-06 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Radar/Antenna Substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate. Radar and antenna technology play an integral role in modern communications and wireless. Their performance and reliability are directly related to the quality and stability of communication. In these technologies, the choice of substrate…

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Showa Denko MCL-E-700G package substrate Manufacturer

2024-05-05 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Showa Denko MCL-E-700G package substrate Manufacturer. FC BGA package substrates and ABF base package substrates supplier, we have made the FC BGA substrates with 22 Layers with microtrace and microgap. As technology continues to advance, electronic devices are becoming smaller and more powerful. In this rapidly growing field, the Showa…

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Aviation Substrate Manufacturer

2024-05-05 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Aviation Substrate Manufacturer. High frequency and high speed materials Aerospace PCB, Satellite PCB or Military PCBs. We offer IPC Class III PCBs from 2 layer to 50 Strati. In the field of modern aviation, the continuous development of technology has always been the engine driving the industry forward. Aviation Substrate,…

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Ceramics Substrate Manufacturer

2024-05-04 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Ceramics Substrate Manufacturer. the Package Substrate will be made with Ceramics core materials, we offer Ceramics package substrates from 1 layer to 16 Strati, and Ceramics PCBs. In today's digital age, the rapid development of electronic technology has brought great convenience and intelligent experience to our lives. As one of…

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Ajinomoto GL102R8HF package substrate Manufacturer

2024-05-04 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Ajinomoto GL102R8HF package substrate Manufacturer . We use advanced Msap and Sap technology to produce the ABF materials FC BGA package substrates from 2 layer to 22 Strati. With the continuous development of electronic equipment, Ajinomoto GL102R8HF packaging substrate as a key component is gradually coming into people's field of…

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