Produttore professionale di substrati per imballaggio BGA.

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CSP package substrate Manufacturer

2024-02-10 Company News / News / Notification / Trade News

CSP package substrate Manufacturer. the Package Substrate will be made with BT dielectric, ABF base, and Showa Denko and other high speed and high frequency materials. CSP Package Substrates play a crucial role in modern PCB engineering, particularly in accommodating and connecting semiconductor chips efficiently. In contrast to traditional methods…

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BT FCCSP Package Substrate Manufacturer

2024-02-09 Company News / News / Notification / Trade News

BT FCCSP Package Substrate Manufacturer. BT materials Substrate and BT resin Package Substrate production. the Materials type are High speed and high frequency base material. Advanced FCCSP Package Substrate production process. The BT FCCSP Package Substrate is an advanced packaging solution utilizing Ball Grid Array (BGA) technology. Its key innovation…

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Wire Bond Substrate Manufacturer

2024-02-08 Company News / News / Notification / Trade News

Semiconductor Wire Bond Substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing. The base materials will be used with BT base materials, Rogers Base materials, High tg FR4 base, ABF base materials. and other more types base materials. Wire bond substrates are vital elements within the realm of…

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Flip Chip CSP Package Substrate Manufacturer

2024-02-07 Company News / News / Notification / Trade News

Professional Flip Chip CSP Package Substrate Manufacturer, we BT core, Rogers core, ABF core or other type subsrtates core to produce ultra-small bump pitch FC CSP package substrate from 2 layer to 20 layers. The Flip Chip CSP Package Substrate represents a groundbreaking advancement in electronic device packaging. By directly…

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Chip-scale package substrate Manufacturer

2024-02-06 Company News / News / Notification / Trade News

Chip-scale package Substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production plant. Chip-Scale Package (CSP) is a cutting-edge packaging technology designed to encapsulate electronic chips in compact packages that closely match their dimensions. This packaging format is extensively employed to achieve reduced size and…

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Cavity Substrate PCB Manufacturer

2024-02-05 Company News / News / Notification / Trade News

Cavity Substrate PCB Manufacturer.High speed and high frequency material cavity packaging substrate manufacturing. Advanced Depth control production technology. We produce the depth and dimensions of the grooves according to your requirements. The paragraph describes the significance of Cavity Substrate PCB in contemporary electronic equipment. It highlights its pivotal role in…

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