Produttore professionale di substrati per imballaggio BGA.

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Package substrate materials introduction

2023-11-17 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Package substrate materials introduction and package substrate manufacture. You can use BT series core, High frequency series Core, high speed series Core materials. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 2 to 20 Strati. In the manufacturing of modern electronic devices, packaging substrates play a…

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What is Microtrace Package Substrates?

2023-11-16 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Microtrace Package Substrates Manufacturing, we mainly produce ultra-small bump pitch substrate with 100um, Microtrace and spacing packaging substrate with 9um to 30um. and from 30 to 80um gap substrates will be more easy manufacturing. In today's highly developed electronic field, 30 micron substrates play a vital role. This thin yet…

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More lower CTE Package Substrate Prototypes

2023-11-15 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

More lower CTE Package Substrate Prototypes, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and HDI PCBs. Production of high multilayer packaging substrates with high speed and high frequency materials. The coefficient of thermal expansion (CTE) is a pivotal concept within the electronics industry, exerting…

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What is Substrate Layer Stackup?

2023-11-14 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Package substrate Supplier. We offer FCBGA package substrates from prototypes up to mid-volume production. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 Strati. Packaging substrates, as a key component of modern electronic equipment, play a vital role. It not only provides mechanical support…

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What is package substrate?

2023-11-13 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Professional Package substrate manufacturer, We offer Package substrate prototypes up to mid-volume production. we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and HDI PCBs. The packaging substrate, referred to as PCB (Printed Circuit Board), is a key electronic component, usually made of insulating materials with…

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What is semiconductor organic packaging substrates?

2023-11-10 Notizie dall'azienda / Notizie / Notifica / Notizie commerciali

Semiconductor organic packaging substrates manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 2 to 20 Strati. In today's digital era, semiconductor technology has assumed an indispensable role in our daily lives. From smartphones to electric cars, nearly all electronic devices rely on semiconductor chips. To…

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