Produttore professionale di substrati per imballaggio BGA.

Tel:+086 0755 85241496 |

Fornitore professionale di substrati per imballaggi Flip-Chip

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About Company

SHENZHEN QYC CO.,LTD

We mainly produce 2-layer to 20-layer packaging substrate, minimum trace 9um, minimum spacing 9um. the best smallest via size are 50um. The Min Bomp Pithc are 100um. and most of the packaging substrate materials we used from Japan. South Korea.The material quality of the substrate is very stable.

ABOUT US

SHENZHEN QYC CO.,LTD

We mainly produce 2-layer to 20-layer packaging substrate, minimum trace 9um, minimum spacing 9um. the best smallest via size are 50um. The Min Bomp Pithc are 100um. and most of the packaging substrate materials we used from Japan. South Korea.The material quality of the substrate is very stable.

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PRODUCTS

Flip-Chip Package Substrate

Package Substrate

FCBGA Packaging Substrate

Substrato di imballaggio per semiconduttori

Substrato per imballaggio in ceramica

Substrato per imballaggio di cavità

Substrato del pacchetto PGA

Substrato del pacchetto SOP

Substrato del pacchetto SIP

CONTACT US

Phone: +86 0755 85241496

E-mail: business@qycltd.com

Skype: Henrychinasz

WhatsAPP: +8615014077679

Address: Oriental Business Building, 182 Baomin 2nd Road, Xixiang Street, Baoan District, Shenzhen, Guangdong,China

Copyright © 2022 SHENZHEN QYC CO.,LTD All Rights Reserved.

+86 0755 85241496

business@qycltd.com

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