Fabricante profissional de substrato de embalagem BGA.

Tel:+086 0755 85241496 |

TradeNews-Page50of307-ProfessionalFlip-ChipPackagingSubstrateSupplier-Page50

Notícias comerciais

Casa

Notícias comerciais

Where to Buy the Package Substrate?

2023-11-06 Notícia / Notícias comerciais

High-precision Package substrate manufacturer. We use advanced Msap and Sap technology to produce High multilayer interconnection substrates from 2 Para 20 Camadas. In modern electronic equipment, packaging substrate (Substrato do pacote) plays a vital role. It is the support and connection hub of electronic components and plays a key role. To…

Ler mais
What is the Chip Package Substrate?

2023-11-03 Notícia / Notícias comerciais

Chip Package Substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um,and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing. In the contemporary digital era, electronic devices have seamlessly woven themselves into every facet…

Ler mais
What is BT Package Substrate?

2023-11-03 Notícias da empresa / Notícia / Notificação / Notícias comerciais

BT package substrate Manufacture. We use advanced Msap and Sap technology to build High multilayer interconnection substrates from 2 Para 20 Camadas. The semiconductor industry has consistently maintained its position at the vanguard of rapid development and innovation, with semiconductor packaging substrates assuming a pivotal role in this trajectory. These…

Ler mais
BGA Package Substrate Vender

2023-11-02 Notícia / Notícias comerciais

BGA Package Substrate Vender, we build ultra-small bump pitch IC/BGA substrate from 2 camada para 20 Camadas, ultra-small trace and spacing packaging substrate and smallest gap PCBs. At the forefront of modern technology, the electronics industry relies heavily on various essential components. Among these, packaging substrates and printed circuit boards…

Ler mais
4-Layer Package Substrate

2023-11-02 Notícias comerciais

4 layer Package Substrate Manufacturing, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and microtrace HDI PCBs. FCBGA package and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 Para 18 Camadas,The core of electronic devices is constantly…

Ler mais
Package Substrate PCB Manufacturing

2023-11-01 Notícias comerciais

Package Substrate PCB Manufacturing. the Package Substrate will be made with BT Base materials, Rogers base materials, Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials.The sophistication and performance of electronic devices depend not only on the design of their internal circuits, but…

Ler mais

+86 0755 85241496

business@qycltd.com

Obter uma tarifa ?