Fabricante profissional de substrato de embalagem BGA.

Tel:+086 0755 85241496 |

WireBondBGAsubstrates-ProfessionalFlip-ChipPackagingSubstrateSupplier

Wire Bond BGA substrates

  1. Casa
  2. Wire Bond BGA substrates

Telefone +86 0755 85241496

Linkedin +8615014077679

E-mail business@qycltd.com

Obter uma tarifa ?