Fabricante profissional de substrato de embalagem BGA.

Tel:+086 0755 85241496 |

WireBondingBGAsubstrates-ProfessionalFlip-ChipPackagingSubstrateSupplier

Wire Bonding BGA substrates

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  2. Wire Bonding BGA substrates

Telefone +86 0755 85241496

Linkedin +8615014077679

E-mail business@qycltd.com

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