Professional BGA Packaging Substrate Manufacturer.

Tel:+086 0755 85241496 |

TradeNews-Page52of307-ProfessionalFlip-ChipPackagingSubstrateSupplier-Page52

Trade News

Home

Trade News

What is the Flip-Chip Package Substrate ?

2023-10-27 Trade News

Professional Flip-Chip Package Substrate manufacturing, ultra-small pitch Bump is 100um, ultra-small trace and pitch 10um/10um, high frequency and high speed material packaging substrates. Flip Chip Package Substrate is a key semiconductor packaging technology that plays an important role in the electronics industry. This article will introduce you to the key…

Read more

+86 0755 85241496

business@qycltd.com

Get a Quote ?