Профессиональный производитель упаковочных подложек BGA.

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Ultra-Multilayer FC-BGA Substrates Manufacturer

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The Ultra-Multilayer FC-BGA Substrates Manufacturer specializes in crafting intricate circuitry for cutting-edge electronics. With unparalleled precision, they engineer substrates that defy complexity, enabling seamless integration of components. Their advanced processes ensure optimal performance, reliability, and efficiency in every substrate produced. Through innovative techniques and state-of-the-art facilities, they meet the demands…

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Specializing in the production of ultra-small FC-LGA substrates, our manufacturing facility prides itself on precision engineering and advanced technology. With a commitment to innovation, we craft substrates that meet the most stringent size requirements without compromising performance. Our expertise lies in creating compact yet robust substrates, tailored to the demands…

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Ultra-small Size BGA/IC Substrates Manufacturer

2024-05-16 Новости компании / Новости / Уведомление / Новости торговли

Ultra-small Size BGA/IC Substrates Manufacturer.High speed and high frequency material packaging substrate Manufacturer. The rapid development of modern electronic devices requires smaller and more powerful components to meet increasingly compact designs and higher performance requirements. Under this challenge, ultra-small size BGA/IC substrates emerged as the times require, becoming a new…

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Micro PCB Substrate Manufacturer

2024-05-16 Новости компании / Новости / Уведомление / Новости торговли

Micro PCB Substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. In today's technology field, micro PCB substrates have become an indispensable and important part of the design and manufacturing of electronic equipment. From smartphones to medical devices, micro PCB substrates play…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

+86 0755 85241496

business@qycltd.com

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