Профессиональный производитель упаковочных подложек BGA.

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GPU Substrates Manufacturer

2024-05-12 Новости компании / Новости / Уведомление / Новости торговли

GPU Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. GPU (graphics processing unit) substrates play a vital role in modern electronics. As one of the core components of electronic equipment, GPU substrates not only provide support for computer graphics processing, but…

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Ultrathin BGA Package Substrates Manufacturer

2024-05-12 Новости компании / Новости / Уведомление / Новости торговли

Ultrathin BGA Package Substrates Manufacturer . the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials. As electronic devices become increasingly refined and functional, ultra-thin BGA (Ball Grid Array) packaging substrates have emerged as a key technology. These packaging substrates, with their extremely thin design and…

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Ultra-thin CPU BGA Substrates Manufacturer

2024-05-11 Новости компании / Новости / Уведомление / Новости торговли

Ultra-thin CPU BGA Substrates Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. With the rapid development of electronic technology, ultra-thin CPU BGA substrates are becoming an indispensable core component in modern electronic equipment. These precision-engineered substrates not only make devices thinner,…

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ABF GX92R Package Substrates Manufacturer

2024-05-11 Новости компании / Новости / Уведомление / Новости торговли

ABF GX92R Package Substrates Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 Кому 18, ABF GX92R packaging substrate is one of the leading technologies in today's electronics industry. It not only provides excellent reliability and performance for electronic products, but also sets a new…

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FC-LGA Package Substrates Manufacturer

2024-05-10 Новости компании / Новости / Уведомление / Новости торговли

FC-LGA Package Substrates Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials. FC-LGA (Flip Chip Land Grid Array) packaging substrate is an indispensable and important component in modern electronic equipment. This article will delve into the critical role of FC-LGA packaging substrate and its…

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Aviation PCB Manufacturer

2024-05-10 Новости компании / Новости / Уведомление / Новости торговли

Aviation PCB Manufacturer.High speed and high frequency material packaging substrate Manufacturer. Advanced packaging substrate. With the vigorous development of the aviation industry and the rapid advancement of electronic technology, the design and manufacturing of avionics equipment is moving towards more complexity and precision. In this highly competitive and quality-critical industry,…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

+86 0755 85241496

business@qycltd.com

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