Профессиональный производитель упаковочных подложек BGA.

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Chip Package Substrates Manufacturer

2024-05-09 Новости компании / Новости / Уведомление / Новости торговли

Chip Package Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate. Chip packaging substrates play a vital role in modern electronics. As core components of electronic equipment, they carry the important functions of circuits and provide stable circuit connections and support for various applications.…

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2024-05-09 Новости компании / Новости / Уведомление / Новости торговли

Ultrathin RF PCB Manufacturer . we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap. With the rapid development of science and technology, the requirements for electronic equipment are also constantly increasing. In this era of continuous pursuit of thinner,…

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RF/microwave PCB Manufacturer

2024-05-07 Новости компании / Новости / Уведомление / Новости торговли

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Ultra-thin BGA Substrate Manufacturer

2024-05-07 Новости компании / Новости / Уведомление / Новости торговли

Ultra-thin BGA Substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate. With the rapid development of electronic technology, the smart devices around us are becoming more and more compact and exquisite, but their functions are becoming increasingly powerful. In this ubiquitous electronic revolution, ultra-thin…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

+86 0755 85241496

business@qycltd.com

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