Профессиональный производитель упаковочных подложек BGA.

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Ultrathin BT PCB Manufacturing

2024-03-17 Новости компании / Новости / Уведомление / Новости торговли

Ultrathin BT PCB Manufacturing. Ultrathin/extra small spacing BT LED PCBs, Ultrathin package substrates. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate manufacturer . In today's electronics industry, ultra-thin Bluetooth PCB has become an indispensable core component of many innovative products. This article will lead you to…

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What is BT laminate substrate?

2024-03-16 Новости компании / Новости / Уведомление / Новости торговли

Bt laminate substrate manufacturing. BT resin has a wide range of materials, we can use the BT base to make the Mini LED PCBs. we also have used the BT base produce the BGA/IC package substrates from 2 layer to 20 Слои. BT laminated substrate, full name Bismaleimide Triazine, is…

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What is Mini LED PCB?

2024-03-15 Новости компании / Новости / Уведомление / Новости торговли

Mini led pcb manufacturing. Features: microtrace(30um), ultra-small spacing(30um), ultra-thin finished board thickness, finished board surface flatness is higher, easier to assemble components. Mini LED PCB (Printed Circuit Board) is an innovative product that combines micro LED (Light-Emitting Diode) and circuit board technology. This circuit board enables a highly integrated display…

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Rigid-flex BGA Substrate

2024-03-14 Новости компании / Новости / Уведомление / Новости торговли

Rigid-flex BGA substrate Manufacture. the Rigid-flex BGA substrate will be made with Flex base materials and hard boards base materials. you can use the High speed materials or other types materials. Features: Ultra-small gap. Rigid-Flex BGA Substrates, translated as rigid-flexible BGA substrate in Chinese, is an innovative PCB engineering solution…

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Semiconductor BGA substrate Manufacturer

2024-03-13 Новости компании / Новости / Уведомление / Новости торговли

Semiconductor BGA substrate Manufacturer. the Package Substrate will be made with BT,Роджерс, Isola, Showa Denko and Ajinomoto High speed materials. Semiconductor BGA Substrate, the semiconductor BGA substrate, is a key electronic component that plays an important role in supporting and connecting semiconductor devices. It provides solid physical support and reliable…

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FC BGA substrate design rules

2024-03-12 Новости компании / Новости / Уведомление / Новости торговли

FC BGA substrate design rules and Semiconductor FC BGA substrate Firm. High multilayer FC BGA package substrate design reference rules. and High speed and high frequency material packaging substrate manufacturing. Advanced packaging manufacturing technique. Semiconductor FC BGA (ball ball array) substrate is a technology component that plays a key role…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

+86 0755 85241496

business@qycltd.com

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