Профессиональный производитель упаковочных подложек BGA.

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Top 10 package Substrate Manufacturer

2024-03-01 Новости компании / Новости / Уведомление / Новости торговли

Top 10 package Substrate Manufacturer. У нас есть команда из более чем 100 engineers, more than 15,000 employees, large production scale and high-precision packaging substrate production lines. A packaging substrate stands as a crucial and irreplaceable element within contemporary electronic devices. Essentially, it serves as a fundamental framework facilitating the…

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Global Packaging Substrate

2024-02-29 Новости компании / Новости / Уведомление / Новости торговли

Global Packaging Substrate Manufacturer. We use advanced Msap and Sap technology to manufacture the High multilayer interconnection Packaging substrates from 2 layer to 20 Слои. the shipping time is only about 1 Кому 2 month. In the swiftly advancing electronics sector of today, Global Packaging Substrate Manufacturers are indispensable entities.…

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Global package Substrate

2024-02-28 Новости компании / Новости / Уведомление / Новости торговли

Global package Substrate Manufacturer. Professional engineering team, large scale packaging substrate production line. the Package Substrate will be made with BT, Showa Denko and Ajinomoto High speed materials. or other types materials. Package substrate, also known simply as substrate, constitutes a fundamental element in the packaging and interconnection of electronic…

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Global Semiconductor packaging Substrate

2024-02-27 Новости компании / Новости / Уведомление / Новости торговли

Global Semiconductor packaging Substrate Firm. High speed and high frequency material packaging substrate manufacturing. The packaging substrate will be made with BT materials, ABF materials, Rogers materials. or other series base materials. The PCB Package Substrate, a pivotal component within semiconductor packaging, is a common facet encountered in daily professional…

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Global Semiconductor Substrate Manufacturer

2024-02-26 Новости компании / Новости / Уведомление / Новости торговли

We are a professional Global Semiconductor Substrate Manufacturer, we mainly produce ultra-small bump pitch package substrate, ultra-small trace and spacing. High quality and fast lead time. Semiconductor substrates are fundamental components within the modern electronics industry, serving as essential materials for fabricating integrated circuits. Essentially, a semiconductor substrate acts as…

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Module Substates Manufacturer

2024-02-23 Новости компании / Новости / Уведомление / Новости торговли

Module Substates Manufacturer. the Package Substrate will be made with Rogers, BT, Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials. Module Substrate is a crucial material in the manufacturing of electronic modules, encompassing various types, each tailored for specific applications. One prominent…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

+86 0755 85241496

business@qycltd.com

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