Профессиональный производитель упаковочных подложек BGA.

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FC-CSP Substrates Manufacturer

2024-02-22 Новости компании / Новости / Уведомление / Новости торговли

FC-CSP Substrates Manufacturer. We use advanced Msap and Sap technology to manufacture the High multilayer interconnection FC-CSP substrates from 2 to 20layers, use the High speed and high frequency materials. Have you ever been curious about the packaging technologies used in electronic devices? Today, let us explore an advanced packaging…

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CPCORE Structure substrates Manufacturer

2024-02-21 Новости компании / Новости / Уведомление / Новости торговли

CPCORE Structure substrates Manufacturer. the Package Substrate will be made with BT base and Showa Denko and Ajinomoto High speed materials. or other types Structure Structure materials. Packaging substrates are essential components in contemporary electronic devices, serving crucial functions in supporting, interconnecting, and safeguarding chips and other electronic elements. As…

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SHDBU Substrates Manufacturer

2024-02-20 Новости компании / Новости / Уведомление / Новости торговли

SHDBU Substrates Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate company. Packaging substrates are essential elements within the contemporary electronics sector, serving as fundamental materials that facilitate the connection between chips and external circuits. They bear the dual responsibilities of structural support and signal transmission.…

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High Speed package Substrate

2024-02-19 Новости компании / Новости / Уведомление / Новости торговли

High Speed package Substrate Manufacturer. High Speed material has BT series materials, ABF series materials. We use advanced Msap and Sap technology to manufacture the High multilayer interconnection High Speed substrates from 2 Кому 20 Слои. The passage discusses the importance of high-speed packaging substrates in electronic communications. These substrates are…

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High Frequency package Substrate Manufacturer

2024-02-18 Новости компании / Новости / Уведомление / Новости торговли

High Frequency package Substrate Manufacturer. Some package Substrate will be made with High Frequency materials. Как: Rogers materials package Substrate. or rogers cavity package substrate. Most of the Package Substrate will be made with BT base, Some were made with Showa Denko and Ajinomoto High speed materials. we can…

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High precision packaging substrate Manufacturer

2024-02-17 Новости компании / Новости / Уведомление / Новости торговли

High precision packaging substrate Manufacturer. We use the mSap and Sap Advanced production technology to produce the Package Substrate. and the packaging substrate will be made with BT, and Showa Denko and Ajinomoto base materials. or other types High speed materials, or maybe high frequency materials. This passage emphasizes the…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

+86 0755 85241496

business@qycltd.com

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