Профессиональный производитель упаковочных подложек BGA.

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CSP package substrate Manufacturer

2024-02-10 Новости компании / Новости / Уведомление / Новости торговли

CSP package substrate Manufacturer. the Package Substrate will be made with BT dielectric, ABF base, and Showa Denko and other high speed and high frequency materials. CSP Package Substrates play a crucial role in modern PCB engineering, particularly in accommodating and connecting semiconductor chips efficiently. In contrast to traditional methods…

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BT FCCSP Package Substrate Manufacturer

2024-02-09 Новости компании / Новости / Уведомление / Новости торговли

BT FCCSP Package Substrate Manufacturer. BT materials Substrate and BT resin Package Substrate production. the Materials type are High speed and high frequency base material. Advanced FCCSP Package Substrate production process. The BT FCCSP Package Substrate is an advanced packaging solution utilizing Ball Grid Array (BGA) technology. Its key innovation…

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Wire Bond Substrate Manufacturer

2024-02-08 Новости компании / Новости / Уведомление / Новости торговли

Semiconductor Wire Bond Substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing. The base materials will be used with BT base materials, Rogers Base materials, High tg FR4 base, ABF base materials. and other more types base materials. Wire bond substrates are vital elements within the realm of…

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Flip Chip CSP Package Substrate Manufacturer

2024-02-07 Новости компании / Новости / Уведомление / Новости торговли

Professional Flip Chip CSP Package Substrate Manufacturer, we BT core, Rogers core, ABF core or other type subsrtates core to produce ultra-small bump pitch FC CSP package substrate from 2 layer to 20 Слои. The Flip Chip CSP Package Substrate represents a groundbreaking advancement in electronic device packaging. By directly…

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Chip-scale package substrate Manufacturer

2024-02-06 Новости компании / Новости / Уведомление / Новости торговли

Chip-scale package Substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production plant. Chip-Scale Package (CSP) is a cutting-edge packaging technology designed to encapsulate electronic chips in compact packages that closely match their dimensions. This packaging format is extensively employed to achieve reduced size and…

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Cavity Substrate PCB Manufacturer

2024-02-05 Новости компании / Новости / Уведомление / Новости торговли

Cavity Substrate PCB Manufacturer.High speed and high frequency material cavity packaging substrate manufacturing. Advanced Depth control production technology. We produce the depth and dimensions of the grooves according to your requirements. The paragraph describes the significance of Cavity Substrate PCB in contemporary electronic equipment. It highlights its pivotal role in…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

+86 0755 85241496

business@qycltd.com

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