Профессиональный производитель упаковочных подложек BGA.

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What is a BGA substrate?

2024-01-25 Новости компании / Новости / Уведомление / Новости торговли

Semiconductor BGA substrate manufacture. extra small bump pitch with 100um, extra small trace and spacing are 9um. we also can make the BGA substrate with ultrathin base materials. Within the ever-evolving realm of semiconductor design, Ball Grid Array (BGA) substrates have emerged as indispensable components, playing a vital role in…

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What exactly is Rigid-Flex Packaging Substrate?

2024-01-24 Новости компании / Новости / Уведомление / Новости торговли

We are a professional Rigid-flex packaging substrate Maker, we mainly produce BGA Rigid-Flex Packaging Substrate and Rigid-Flex BGA Substrate from 4 layer to 20 Слои. The concept of Rigid-Flex Packaging Substrate, an electronic packaging solution that seamlessly integrates rigid and flexible materials, has emerged in response to the dynamic requirements…

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Hot to Build Rigid-Flex BGA Substrates?

2024-01-23 Новости компании / Новости / Уведомление / Новости торговли

Build Rigid-Flex BGA Substrates. Professional Rigid-flex BGA substrate Supplier, we mainly produce ultra-small bump pitch and ultra-small trace Rigid-Flex BGA Substrates. Rigid-Flex BGA Substrates epitomize the forefront of innovation in modern PCB engineering, transforming the landscape of electronic component mounting and interconnection with their unique design. These substrates skillfully integrate…

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How to build Ceramic Packaging Substrate?

2024-01-22 Новости компании / Новости / Уведомление / Новости торговли

Build A Ceramic Packaging Substrate. Professional Ceramic packaging substrate Supplier, we mainly produce ultra-small bump pitch and ultra-small trace Ceramic Packaging Substrate and Ceramic PCBs. In the dynamic field of PCB design, Ceramic Packaging Substrate emerges as a vital element, playing a foundational role in the assembly and interconnection of…

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How to build a semiconductor substrate?

2024-01-19 Новости компании / Новости / Уведомление / Новости торговли

Build a Semiconductor substrate. Substrate supplier,, we use High speed and high frequency substrates to produce ultra-small bump pitch, ultra-small trace substrate and HDI PCBs. Semiconductor substrates play a crucial role in contemporary electronic circuit design and manufacturing, serving as essential components that carry out vital functions in electronic devices.…

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What is a semiconductor packaging substrate?

2024-01-18 Новости компании / Новости / Уведомление / Новости торговли

Professional Semiconductor packaging substrate Company, we mainly produce ultra-small bump pitch package substrate and PCBs. In the modern landscape of electronic design and manufacturing, semiconductor packaging substrates play a crucial role as fundamental components, serving as the foundation for sophisticated Printed Circuit Boards (PCBs). Their primary purpose is to enable seamless…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

+86 0755 85241496

business@qycltd.com

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