Профессиональный производитель упаковочных подложек BGA.

Тель:+086 0755 85241496 |

CompanyNews-Page43of294-ProfessionalFlip-ChipPackagingSubstrateSupplier-Page43

Новости компании

Дом

Новости компании

What is Ceramic Packaging Substrate?

2023-12-29 Новости компании / Новости / Уведомление / Новости торговли

Ceramic Package Substrate Manufacturer. Ceramic 96 AL2O3 Substrate amd Ceramic ALN Substrate materials. We can use this base materials to make the PCBs. or Ceramic Package Substrates. High quality and fast shipping time. Primarily, the outstanding rigidity of ceramic packaging substrates is instrumental in maintaining structural stability within high-density circuit…

Подробнее
What is Semiconductor BGA Substrate?

2023-12-28 Новости компании / Новости / Уведомление / Новости торговли

Semiconductor BGA Substrate Supplier. High speed and high frequency material packaging substrate manufacturing. We have a professional production team, advanced production equipment. Semiconductor Ball Grid Array Substrate (Подложка BGA) stands out as an advanced technology garnering considerable attention within the realm of printed circuit boards (PCBs). Distinguished by its unique…

Подробнее
What is Semiconductor FC BGA Substrate?

2023-12-27 Новости компании / Новости / Уведомление / Новости торговли

Semiconductor FC BGA Substrate Firm, We mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate. Most of the FCBGA substrates were made with ABF base materials. The Semiconductor FC BGA substrate stands out as an exemplary manifestation of semiconductor packaging technology, seamlessly amalgamating the exceptional benefits of…

Подробнее
What is Flex-Rigid Packaging Substrate?

2023-12-26 Новости компании / Новости / Уведомление / Новости торговли

Flex-Rigid Packaging Substrate Manufacture. Professional BGA Flex-Rigid Substrate Firm. To use the BT base to produce the Flex-Rigid BGA Substrate from 4 layer to 30 Слои. In the domain of PCB (Printed Circuit Board) engineering, the Rigid-Flex Packaging Substrate emerges as a groundbreaking substrate variant, heralding a new era in…

Подробнее
What is Rigid-Flex BGA Substrate?

2023-12-25 Новости компании / Новости / Уведомление / Новости торговли

Rigid-Flex BGA Substrate Manufacturer. Hard board and soft board process combination. To use the BT base and Flex base produce the Rigid-Flex BGA Substrates. The advantages are Microtrace and smallest gap with 9um/9um. The Rigid-Flex BGA Substrate stands out as a cutting-edge design within advanced PCB engineering, seamlessly integrating rigid…

Подробнее
What is Ceramic Packaging Substrate?

2023-12-22 Новости компании / Новости / Уведомление / Новости торговли

Ceramic Packaging Substrate Manufacturing, Not only to use BT base, ABF base, Rogers Base, High TG FR4 base, we also can use the Ceramic base materials to build the Packaging Substrate. Как: 96 L2O3 Ceramic Substrates, ALN Ceramic Substrates. and other types Ceramic base materials. Ceramic packaging substrates, as…

Подробнее

ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

+86 0755 85241496

business@qycltd.com

Узнать цену ?