Профессиональный производитель упаковочных подложек BGA.

Тель:+086 0755 85241496 |

CompanyNews-Page49of294-ProfessionalFlip-ChipPackagingSubstrateSupplier-Page49

Новости компании

Дом

Новости компании

Ultra-small bump pitch substrate

2023-11-08 Новости компании / Новости / Уведомление / Новости торговли

Ultra-small bump pitch substrate manufacture, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and HDI PCBs. Packaging substrates, serving as the cornerstone of modern electronics, hold a position of paramount importance. Their significance extends beyond merely providing support and interconnections for various electronic components; it…

Подробнее
Types of materials for high-speed packaging substrate

2023-11-08 Новости компании / Новости / Уведомление / Новости торговли

High speed package substrate supplier. Types of materials for high-speed packaging substrate. we have used the Showa Denko and Ajimomoto and BT base materials. or maybe Rogers high frequency materials. Within the realm of contemporary electronics, laminates emerge as an indispensable technology. Serving as a fundamental component in the domain…

Подробнее
Top 10 IC Packaging Substrate Firm

2023-11-07 Новости компании / Новости / Уведомление / Новости торговли

IC Packaging Substrate Producer. the Package Substrate will be made with BT materials, Rogers materials, High TG FR4 Base, Showa Denko and Ajinomoto High speed materials. or other types high speed materials and high frequency materials. In the realm of modern electronics, the significance of IC packaging substrates cannot be…

Подробнее
What is IC Package Substrate?

2023-11-07 Новости компании / Новости / Уведомление / Новости торговли

We are a professional IC package substrate producer, we mainly produce ultra-small trace and spacing IC packaging substrate and HDI PCBs. The material selection for flip chip package substrates holds significant importance. In flip chip packaging, various materials, such as organic substrates, ceramics, and silicon, are commonly utilized, each presenting…

Подробнее
What is BT Package Substrate?

2023-11-03 Новости компании / Новости / Уведомление / Новости торговли

BT package substrate Manufacture. We use advanced Msap and Sap technology to build High multilayer interconnection substrates from 2 Кому 20 Слои. The semiconductor industry has consistently maintained its position at the vanguard of rapid development and innovation, with semiconductor packaging substrates assuming a pivotal role in this trajectory. These…

Подробнее
Exploring Package Substrate Materials

2023-10-31 Новости компании / Новости / Уведомление / Новости торговли

We are Package Substrate Firm.Exploring Package Substrate Materials.Such as: Showa Dekno series: MCL-E705G, MCL-E-770G, Ajinomoto series: GX92R, GXT31R2, and so on. we are a professional package substrate maker. In today's digital age, electronic devices have become an indispensable part of our lives. Whether it is our smartphones, computers, or automotive…

Подробнее

ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

+86 0755 85241496

business@qycltd.com

Узнать цену ?