Профессиональный производитель упаковочных подложек BGA.

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Ultra-Multilayer FC-BGA Substrates Manufacturer

2024-05-20 Новости компании / Новости / Уведомление / Новости торговли

The Ultra-Multilayer FC-BGA Substrates Manufacturer specializes in crafting intricate circuitry for cutting-edge electronics. With unparalleled precision, they engineer substrates that defy complexity, enabling seamless integration of components. Their advanced processes ensure optimal performance, reliability, and efficiency in every substrate produced. Through innovative techniques and state-of-the-art facilities, they meet the demands…

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Manufacturer of The CPU Package Substrates

2024-05-19 Новости компании / Новости / Уведомление / Новости торговли

The manufacturer specializes in crafting CPU package substrates, the vital foundation for high-performance computing. With precision engineering and advanced materials, they ensure each substrate meets exacting standards for durability and electrical conductivity. These substrates form the backbone of modern processors, facilitating seamless communication between the CPU and other system components.…

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Ultra-small Size FC-LGA Substrates Manufacturer

2024-05-18 Новости компании / Новости / Уведомление / Новости торговли

Specializing in the production of ultra-small FC-LGA substrates, our manufacturing facility prides itself on precision engineering and advanced technology. With a commitment to innovation, we craft substrates that meet the most stringent size requirements without compromising performance. Our expertise lies in creating compact yet robust substrates, tailored to the demands…

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Flip Chip Ball Grid Array Substrate Manufacturer

2024-05-17 Новости компании / Новости / Уведомление / Новости торговли

A leading manufacturer in the realm of Flip Chip Ball Grid Array substrates, we specialize in crafting innovative solutions that redefine industry standards. With cutting-edge technology and meticulous craftsmanship, we engineer substrates of unparalleled quality and precision. Our dedication to excellence ensures optimal performance and reliability in every substrate produced.…

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Ultra-small Size BGA/IC Substrates Manufacturer

2024-05-16 Новости компании / Новости / Уведомление / Новости торговли

Ultra-small Size BGA/IC Substrates Manufacturer.High speed and high frequency material packaging substrate Manufacturer. The rapid development of modern electronic devices requires smaller and more powerful components to meet increasingly compact designs and higher performance requirements. Under this challenge, ultra-small size BGA/IC substrates emerged as the times require, becoming a new…

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Micro PCB Substrate Manufacturer

2024-05-16 Новости компании / Новости / Уведомление / Новости торговли

Micro PCB Substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. In today's technology field, micro PCB substrates have become an indispensable and important part of the design and manufacturing of electronic equipment. From smartphones to medical devices, micro PCB substrates play…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

+86 0755 85241496

business@qycltd.com

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