Профессиональный производитель упаковочных подложек BGA.

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Chip Package Substrates Manufacturer

2024-05-09 Новости компании / Новости / Уведомление / Новости торговли

Chip Package Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate. Chip packaging substrates play a vital role in modern electronics. As core components of electronic equipment, they carry the important functions of circuits and provide stable circuit connections and support for various applications.…

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2024-05-09 Новости компании / Новости / Уведомление / Новости торговли

Ultrathin RF PCB Manufacturer . we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap. With the rapid development of science and technology, the requirements for electronic equipment are also constantly increasing. In this era of continuous pursuit of thinner,…

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AI Processor Package Substrates Manufacturer

2024-05-08 Новости компании / Новости / Уведомление / Новости торговли

AI Processor Package Substrates Manufacturer . We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4, In today's electronic field, AI processor packaging substrate plays an indispensable role. As core components that connect and support AI chips, they provide a solid foundation for the performance and functionality…

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Ajinomoto GX92 Package Substrate Manufacturer

2024-05-08 Новости компании / Новости / Уведомление / Новости торговли

Ajinomoto GX92 Package Substrate Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials. In today's electronic field, Ajinomoto GX92 packaging substrate plays a vital role. It not only connects various electronic components, but is also responsible for transmitting electrical signals. This article will delve…

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RF/microwave PCB Manufacturer

2024-05-07 Новости компании / Новости / Уведомление / Новости торговли

RF/microwave PCB Manufacturer.High speed and high frequency material packaging substrate Manufacturer. Advanced packaging substrate production. With the rapid development of wireless communication technology, RF (radio frequency) and microwave circuit boards (Печатная плата) have become indispensable key components in modern electronic equipment. This article will delve into the importance of RF/microwave PCBs…

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Ultra-thin BGA Substrate Manufacturer

2024-05-07 Новости компании / Новости / Уведомление / Новости торговли

Ultra-thin BGA Substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate. With the rapid development of electronic technology, the smart devices around us are becoming more and more compact and exquisite, but their functions are becoming increasingly powerful. In this ubiquitous electronic revolution, ultra-thin…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

+86 0755 85241496

business@qycltd.com

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