Профессиональный производитель упаковочных подложек BGA.

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Chip Substrates

2024-04-16 Новости компании / Новости / Уведомление / Новости торговли

What exactly are Chip Substrates? Chip Substrates Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection bga substrates from 4 Кому 20 Слои. In the field of modern electronics, Printed Circuit Boards (PCBs) play a vital role. They are the core components of electronic equipment…

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Minimum spacing PCB

2024-04-15 Новости компании / Новости / Уведомление / Новости торговли

Minimum spacing PCB manufacturer. Ultra-small gap BGA substrates, Smallest gap LED PCBs, and High speed and high frequency material HDI PCBs,We offer minimum clearance PCB from 2 layer to 30 Слои. In the world of minimum pitch PCB manufacturing, we will explore exciting areas! Printed circuit boards (PCBs) are the backbone…

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RT/duroid® 5880 Laminates PCB

2024-04-15 Новости компании / Новости / Уведомление / Новости торговли

RT/duroid® 5880 Laminates PCB Manufacturer, Роджерс 5880 Печатная плата, Rogers Mixed dielectric material PCBs Vendor. we offer Ro5880 PCB from 2 layer to 30 Слои. RT/duroid® 5880 laminates play a key role in today's electronics landscape. Its unique performance characteristics make it one of the preferred materials in PCB design and…

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96AL2O3 Ceramic pcb Manufacturer

2024-04-14 Новости компании / Новости / Уведомление / Новости торговли

96AL2O3 Ceramic pcb manufacturer. Ceramic Series material PCB and Ceramic package substrates Vendor, we offer Ceramic PCB and BGA substrates from 2 layer to 20 Слои. In today's digital era, 96AL2O3 ceramic PCB manufacturing technology is driving the continuous development of the electronic field at an alarming rate. Whether it…

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Glass Substrates Manufacturer

2024-04-13 Новости компании / Новости / Уведомление / Новости торговли

Glass Substrates manufacturer. Advanced glass packaging substrate manufacturer, advanced production equipment and team, we produce high layer glass substrate and ABF substrate from 2 layer to 22 Слои. In modern electronic products, printed circuit boards (PCBs) are an indispensable component. However, for manufacturing PCBs, do we often consider using glass…

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Microtrace PCB

2024-04-12 Новости компании / Новости / Уведомление / Новости торговли

Microtrace PCB manufacturing. High speed and high frequency material bga packaging substrate, led pcb, hdi pcb manufacturing. Advanced Microtrace production technology. What is a Microtrace PCB? Microtrace PCB is a highly complex circuit board commonly used to implement high-density and high-performance electronic functions in miniature electronic devices. They play a…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

+86 0755 85241496

business@qycltd.com

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