Профессиональный производитель упаковочных подложек BGA.

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(MIS)Molded Interconnect Substrate

2024-04-12 Новости компании / Новости / Уведомление / Новости торговли

(MIS)Molded Interconnect Substrate Supplier, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing bga packaging substrates from 2 layer to 22 Слои. Molded Interconnect Substrate (MIS), known as molded interconnect substrate in Chinese, is a technology that plays a key role in PCB design and manufacturing. It prints…

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Ultrathin PCB manufacturing

2024-04-11 Новости компании / Новости / Уведомление / Новости торговли

Ultrathin PCB manufacturing, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. What is ultra-thin PCB? Ultra-thin PCB (Printed Circuit Board) is a printed circuit board specially designed for extremely compact electronic devices. Its thickness is usually less than 0.4 mm of traditional PCB.…

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Печатная плата Rogers 4003C

2024-04-11 Новости компании / Новости / Уведомление / Новости торговли

Rogers 4003C PCB manufacturing. High frequency materials Ro4003C PCB and Rogers Series material PCBs Vendor, We offer HDI Rogers Mixed media pressing PCBs from 4 layer to 30 Слои, Ultra-small spacing and Minimum trace with 1.2mil. What is Rogers 4003C PCB? Печатная плата Rogers 4003C, referred to as Rogers 4003C printed…

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Minimum Pad Clearance PCB

2024-04-10 Новости компании / Новости / Уведомление / Новости торговли

Minimum Pad Clearance PCB manufacturing , Ultra-small bump pitch, ultra-small trace and spacing package substrates and LED PCBs Vendor. In today's digital age, printed circuit boards (PCBs) are the unsung heroes that support our daily devices. From smartphones to smartwatches, PCBs are the invisible connectors. However, a deeper dive into…

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Ceramic Packages for MEMS Sensors

2024-04-10 Новости компании / Новости / Уведомление / Новости торговли

Ceramic Packages for MEMS Sensors Vendor. We offer Ceramic package substrates. we also have the Ceramic Packages service. Ceramic packaging is a key technology used to package MEMS sensors. It provides good mechanical support and environmental protection, protecting the sensor from the external environment. By using ceramic materials with high…

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Micro LED PCB

2024-04-09 Новости компании / Новости / Уведомление / Новости торговли

Micro LED PCB manufacturing. High speed and high frequency material Micro LED PCB and Micro HDI PCBs Vendor. we can make the best smallest vias holes size with 2mil(50um). and we also can produce the microtrace and smallest gap HDI PCBs from 4 layer to 30 Слои. In today's electronic…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

+86 0755 85241496

business@qycltd.com

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