Профессиональный производитель упаковочных подложек BGA.

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Micro cavity PCB manufacturing

2024-03-19 Новости компании / Новости / Уведомление / Новости торговли

Micro cavity PCB manufacturing. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest. Micro Cavity PCB manufacturing is one of the vital technologies in the field of electronic device manufacturing. This precision circuit board not only provides stable and reliable…

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BT Epoxy Resin PCB manufacturing

2024-03-19 Новости компании / Новости / Уведомление / Новости торговли

BT Epoxy Resin PCB manufacturing . We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 Кому 18 Слои, This article will delve into the design, manufacturing, and cost aspects of BT epoxy resin PCBs to provide you with a comprehensive guide. From understanding the basic concepts…

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Micro cavity substrates manufacturing

2024-03-19 Новости компании / Новости / Уведомление / Новости торговли

Micro cavity substrates manufacturing. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types Microcavity substrates (MCS) are the backbone of leading electronic devices, enabling compact designs and superior performance. In this comprehensive guide, we dive into the complexities of microcavity substrate manufacturing, exploring…

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Bt laminate PCB manufacturing

2024-03-18 Новости компании / Новости / Уведомление / Новости торговли

Bt laminate PCB manufacturing. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed. BT laminate PCB is a common printed circuit board made of polybutylene terephthalate (PBT) as the base material. It has excellent electrical properties and mechanical strength and is…

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Cavity substrate manufacturing

2024-03-18 Новости компании / Новости / Уведомление / Новости торговли

Cavity substrate manufacturing.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate. Do you want to know how Cavity Substrate in PCB (Printed Circuit Board) works? Cavity Substrate is a key technology that provides more functionality and flexibility to PCBs. This article will delve into the definition, role…

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Low CET PCB manufacturing

2024-03-18 Новости компании / Новости / Уведомление / Новости торговли

We are a professional Low CET PCB manufacturing, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging. Printed Circuit Boards (PCBs) play a vital role in the manufacturing of modern electronic devices. They not only provide support and connections for electronic components, but also implement various functions…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

+86 0755 85241496

business@qycltd.com

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