Профессиональный производитель упаковочных подложек BGA.

Тель:+086 0755 85241496 |

TradeNews-Page34of307-ProfessionalFlip-ChipPackagingSubstrateSupplier-Page34

Новости торговли

Дом

Новости торговли

Ceramic package substrate Manufacturer

2024-03-11 Новости компании / Новости / Уведомление / Новости торговли

Ceramic package substrate Manufacturer. Ceramic series package substrate and Ceramic PCBs. We produce ultra-thin, ultra-thick or ultra-small pitch ceramic PCBs from 1 layer to 20 Слои. Ceramic packaging substrates are a key component in the electronics industry manufactured from ceramic materials to support and connect microscopic electronic components. This material…

Подробнее
Semiconductor IC substrate Manufacturer

2024-03-08 Новости компании / Новости / Уведомление / Новости торговли

Professional Semiconductor IC substrate Manufacturer, we mainly produce ultra-small bump pitch IC/BGA substrate, ultra-small trace and ultra-small spacing are 9um/um. we do the the IC/BGA substrates from 2 layer to 20 Слои. Semiconductor IC substrate, referred to as IC substrate, is a key component used to assemble and connect integrated…

Подробнее
Substrate Packaging Manufacturer

2024-03-07 Новости компании / Новости / Уведомление / Новости торговли

Substrate Packaging Manufacturer. the Package Substrate will be made with FR4, BT, Роджерс, Isola, Showa Denko and Ajinomoto High speed materials. In the context of PCB engineering, Substrate Packaging plays a vital role. It is not only a basic material that supports and connects electronic components, but also a key…

Подробнее
Substrate package Manufacturer

2024-03-06 Новости компании / Новости / Уведомление / Новости торговли

Substrate package Manufacturer. We use advanced Msap and Sap technology to make the High multilayer interconnection substrates from 4 to 20layers, and There are many kinds of materials to choose from. Как: High TG FR4 base, BT base ,Rogers base, ABF base. and other types base materials. Substrate Packages…

Подробнее
Organic Packaging Chip Substrates

2024-03-05 Новости компании / Новости / Уведомление / Новости торговли

Professional Organic Packaging Chip Substrates Manufacturer, Professional Organic Packaging Chip Substrates production equipment, professional engineer team, we produce high quality Organic Packaging Chip Substrates, and fast delivery. Organic packaging chip substrates are essential materials utilized in electronic component packaging within the electronics industry. Unlike traditional rigid substrates, these substrates consist…

Подробнее
Who are the top 10 packaging substrate factories?

2024-03-04 Новости компании / Новости / Уведомление / Новости торговли

Top 10 Packaging Substrate Manufacturer, Professional packaging substrate production factory. It has over 15,000 employees. Professional design team.We produce high quality packaging substrates according to your requirements and deliver them quickly. Package substrate is a critical element within the realm of electronics, serving a fundamental role in the connection and…

Подробнее

ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

+86 0755 85241496

business@qycltd.com

Узнать цену ?