Профессиональный производитель упаковочных подложек BGA.

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Organic FC BGA substrate Manufacturer

2024-02-16 Новости компании / Новости / Уведомление / Новости торговли

Organic FC BGA substrate Manufacturer. the Package Substrate will be made with BT core, Showa Denko core and Ajinomoto High speed materials. This passage discusses the significance of Organic Substrate FC BGA (Fine-pitch Ball Grid Array) in the electronics industry. This advanced packaging technology utilizes organic substrates, offering superior thermal…

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What is Organic Package Substrates?

2024-02-15 Новости компании / Новости / Уведомление / Новости торговли

Semiconductor Organic Package Substrates Firm. An advanced producer of Organic Package Substrates using advanced Msap and Sap process technology. The Organic Package Manufacturer defines a packaging substrate as a crucial component utilized in assembling and packaging integrated circuits (ICs). Typically composed of organic substrates and metallic layers, it is fabricated…

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FCCSP Flip Chip Package Substrate Manufacturer

2024-02-14 Новости компании / Новости / Уведомление / Новости торговли

Professional FCCSP Flip Chip Package Substrate Manufacturer, we mainly produce ultra-small bump pitch Package substrate, ultra-small trace and spacing Flip Chip Package Substrate. The FCCSP (Flip Chip Chip Scale Package) flip chip packaging substrate is an advanced technology pivotal to the electronics industry. It fundamentally involves connecting the chip directly to…

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Embedded Cavity Substrate Manufacturer

2024-02-13 Новости компании / Новости / Уведомление / Новости торговли

Embedded Cavity Substrate Manufacturer. Open a cavity or multi-cavity on the PCBs. or the BGA pads in the Cavity slot. we have made many this types Embedded Cavity PCBs or Embedded Cavity Package substrates with high quality. Embedded cavity substrates are an important part of modern PCB engineering, and their…

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Organic Package Substrates Manufacturer

2024-02-12 Новости компании / Новости / Уведомление / Новости торговли

Organic Package substrates Manufacturer. we offer the best samllest bump pitch with 100um, the best smallest trace and gap are 9um. the Organic Package Substrates will be finished with high quality and fast shipping time. In the ever-evolving PCB engineering, organic packaging substrates play a vital role. They are a…

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BGA Cavity Substrate Manufacturer

2024-02-11 Новости компании / Новости / Уведомление / Новости торговли

BGA Cavity Substrate Manufacturer. Embedded slot IC PCB and Embedded BGA cavity PCBs provider. We use advanced cavity PCBs technology to produce High multilayer interconnection cavity substrates from 4 Кому 30 Слои. In modern PCB assembly, BGA cavity substrates play a vital role, providing reliable support for the mounting and…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

+86 0755 85241496

business@qycltd.com

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