Профессиональный производитель упаковочных подложек BGA.

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FCCSP-Flip Chip CSP substrates Manufacturer

2024-02-02 Новости компании / Новости / Уведомление / Новости торговли

FCCSP-Flip Chip CSP substrates Manufacturer. We use advanced Msap and Sap technology to High multilayer interconnection FCCSP substrates from 4 Кому 20 Слои. to use the BT base and ABF base materials or others types core materials. Flip Chip Chip Scale Package (FCCSP) substrates are a crucial element in modern…

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Embedded Cavity PCB Manufacturer

2024-02-01 Новости компании / Новости / Уведомление / Новости торговли

Embedded Cavity PCB Substrate Manufacturer, Embedded Components/IC PCB, Embedded slot PCB and Depth control Cavity PCBs manufacturing. The Embedded Cavity PCB Substrate represents cutting-edge technology in PCB (Printed Circuit Board) engineering, providing an innovative design tailored to the compact, efficient, and high-performance requirements of contemporary electronic devices. Unlike conventional PCBs,…

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Flip Chip CSP (FCCSP) Substrates Manufacturer

2024-01-31 Новости компании / Новости / Уведомление / Новости торговли

Flip Chip CSP (FCCSP) Substrates Manufacturer. the best samllest bump pitch with 100um, the best smallest trace and spacing are 9um/9um.Use ABF high speed materials or high frequency materials. Within the complex domain of Printed Circuit Board (Печатная плата) design, Flip Chip Chip Scale Package (FCCSP) substrates have become essential components,…

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Cavity PCB Substrate Manufacturer

2024-01-30 Новости компании / Новости / Уведомление / Новости торговли

Professional Cavity PCB Substrate Manufacturer, we offer Cavity slot PCB and Cavity BGA substrates from 4 layer to 30 laers. High frequency and high speed materials are used to produce such Cavity PCBs. Cavity PCB Substrate, also known as grooved PCB substrate, is a technology leading innovation in electronic design.…

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Ceramic package substrate Firm

2024-01-29 Новости компании / Новости / Уведомление / Новости торговли

Ceramic package substrate Firm. We use advanced Msap and Sap technology to produce High multilayer interconnection Ceramic package substrates from 4 Кому 20 Слои. Ceramic packaging substrates are essential components in modern PCB design, facilitating the connection and placement of electronic elements. Crafted from advanced ceramic materials, they offer heightened…

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What is Semiconductor FC BGA Substrate?

2024-01-26 Новости компании / Новости / Уведомление / Новости торговли

Semiconductor FC BGA substrate firm. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production equipment and production process. Semiconductor FC BGA Substrate is an innovative advancement derived from the latest Ball Grid Array (BGA) packaging technology within electronic engineering. This packaging technology stands out due to…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство материалов для подложек для упаковки мы использовали из Японии. Южная Корея.Качество материала основания очень стабильное.

+86 0755 85241496

business@qycltd.com

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